HEAT PUMP SYSTEM

WIPO Patent Application WO/2022/228345

A1

The present application provides a heat pump system, comprising a compressor, a first heat exchanger, a second heat exchanger, and a valve device. A first connecting port of the valve device is connected to an exhaust port of the compressor, a second connecting port of the valve device is connected to a first port of the second heat exchanger, a third connecting port of the valve device is connected to an air suction port of the compressor, a fourth connecting port of the valve device is connected to a first port of the first heat exchanger, and a fifth connecting port of the valve device is connected to a fourth port of the first heat exchanger. The valve device is configured to: when the heat pump system is operating in a refrigeration mode, the valve device communicates the third connecting port thereof with the air suction port of the compressor, so that the first heat exchanger acts as a falling film evaporator; and when the heat pump system is operating in a heating mode, the valve device communicates the first connecting port thereof with the exhaust port of the compressor, so that the first heat exchanger acts as a condenser.

QIU XIENING (CN)
XIAO TIANLONG (CN)
WANG YONG (CN)
YUAN BIN (CN)

PCT/CN2022/088780

November 03, 2022

April 24, 2022

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YORK GUANGZHOU AIR CONDITIONING AND REFRIGERATION CO LTD (CN)
JOHNSON CONTROLS TYCO IP HOLDINGS LLP (US)

F25B30/06

CN108036658A	2018-05-15
CN107965941A	2018-04-27
CN103727707A	2014-04-16
CN101089520A	2007-12-19
CN104406329A	2015-03-11
CN105466080A	2016-04-06
CN102878724A	2013-01-16
CN102853575A	2013-01-02

TUO YING LAW OFFICES (SHANGHAI) (CN)

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