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Title:
HEAT-RESISTANT ACRYLIC ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/249965
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an acrylic adhesive which has excellent adhesion strength at high temperatures and gives cured objects having excellent elongation. The provided acrylic adhesive is a two-pack mixing type acrylic adhesive composition which comprises (A) a urethane (meth)acrylate including a lowly crystalline poly(tetramethylene glycol) as a backbone skeleton, (B) a polymerizable vinyl monomer, (C) an organic peroxide, and (D) a reducing agent as essential components.

Inventors:
KOTANI JUN (JP)
KONNO MAKOTO (JP)
Application Number:
PCT/JP2022/020781
Publication Date:
December 01, 2022
Filing Date:
May 19, 2022
Export Citation:
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Assignee:
CEMEDINE CO LTD (JP)
International Classes:
C09J4/00; C08F290/06; C09J11/06
Domestic Patent References:
WO2020100832A12020-05-22
Foreign References:
US20020099138A12002-07-25
JPH0297585A1990-04-10
JP2017125178A2017-07-20
JP2000345111A2000-12-12
JPH09241585A1997-09-16
JP2019089889A2019-06-13
JP2018172565A2018-11-08
JP2000355647A2000-12-26
JPH07268050A1995-10-17
JP2007505198W
JP2015182248A2015-10-22
JP2018188602A2018-11-29
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (JP)
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