Title:
CLEANING METHOD AND PLASMA TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2022/249964
Kind Code:
A1
Abstract:
A cleaning method according to the present disclosure comprises a first cleaning step and a second cleaning step. The first cleaning step comprises a step for supplying a first treatment gas into a chamber, and a step for generating, in a space defined by a mounting region and an electrode, a first plasma from the first treatment gas to clean a region of the mounting base including the mounting region. The second cleaning step comprises: a step for holding the dummy substrate opposite to the mounting region at a predetermined position a predetermined distance away from the mounting region; a step for supplying a second treatment gas into the chamber; and a step for generating, in a space defined by the dummy substrate being held at the predetermined position and the electrode, a second plasma from the second treatment gas to clean a region of the mounting base including an area around the mounting region.
More Like This:
| JPH01289253 | ETCHING APPARATUS |
| JP2003309107 | ETCHING METHOD FOR LAMINATED FILM |
| WO/2013/187429 | PLASMA ETCHING METHOD AND PLASMA TREATMENT DEVICE |
Inventors:
SASAKI JUNICHI (JP)
YEO YUBIN (KR)
ONODERA YUKI (JP)
TAKAYAMA TAKAMITSU (JP)
YEO YUBIN (KR)
ONODERA YUKI (JP)
TAKAYAMA TAKAMITSU (JP)
Application Number:
PCT/JP2022/020773
Publication Date:
December 01, 2022
Filing Date:
May 19, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H01L21/31
Foreign References:
| JP2019160816A | 2019-09-19 | |||
| JP2017054854A | 2017-03-16 | |||
| JP2002124511A | 2002-04-26 | |||
| JP2018049896A | 2018-03-29 | |||
| JP2006100705A | 2006-04-13 |
Attorney, Agent or Firm:
SATO, Atsushi et al. (JP)
Download PDF: