Title:
HEAT-RESISTANT ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/204091
Kind Code:
A1
Abstract:
Provided is a heat-resistant adhesive film for a semiconductor package manufacturing step, the heat-resistant adhesive film having low adhesive strength at room temperature and favorable reworkability and attachability to a lead frame, wherein, when the film is attached to a lead frame and is then subjected to a high-temperature environment of a sealing step even without a heat treatment step, the adhesive strength to the lead frame can be immediately increased to prevent resin leakage. This heat-resistant adhesive film comprises: a substrate; and a silicone adhesive layer obtained by curing, on one surface of the substrate, at least an addition-curable silicone composition, wherein a silicone cured product having a phenolic hydroxyl group is used as the silicone cured product constituting the silicone adhesive layer.
Inventors:
SHIMIZU TAKASHI (JP)
KUROSAKI KAISHI (JP)
KUROSAKI KAISHI (JP)
Application Number:
PCT/JP2023/014629
Publication Date:
October 26, 2023
Filing Date:
April 10, 2023
Export Citation:
Assignee:
FUJI KAGAKU SHIKOGYO (JP)
International Classes:
H01L21/56; C09J7/38; C09J183/04; C09J183/07
Foreign References:
| JP2001345415A | 2001-12-14 | |||
| JP2002275435A | 2002-09-25 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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