HEAT-RESISTANT ALLOY MEMBER AND PRODUCTION METHOD THEREFOR, AND HIGH TEMPERATURE DEVICE AND PRODUCTION METHOD THEREFOR

WIPO Patent Application WO/2022/208861

A1

A heat-resistant alloy member comprising: a heat-resistant alloy substrate; Re-based, W-based, or Cr-based multipurpose alloy layer provided on the surface thereof in a region that comprises at least a region where thermal insulation should be carried out; a bond layer comprising an Al-containing alloy provided thereon in a region that comprises at least a region where thermal insulation should be carried out; and a top layer comprising a thermally insulating ceramic provided thereon only in a region where thermal insulation should be carried out. An alloy comprising a Fe-based alloy, a Co-based alloy, a Ni-based alloy with a Cr content of not more than 20 atom%, etc. can be used for the heat-resistant alloy substrate. Particularly when using a Cr-based multipurpose alloy layer, a layer comprising a Ni-based alloy containing greater than 24.5 atom% total of one or more kinds of metal selected from the group consisting of Cr, Mo, Nb, and W and comprising at least Cr is used.

NARITA TOSHIO (JP)
KATO YASUMICHI (JP)
NARITA TAKURO (JP)
OTSUKA MOTOHIRO (JP)
ARA MAYUMI (JP)

PCT/JP2021/014268

October 06, 2022

April 02, 2021

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DBC SYSTEM R&D CO LTD (JP)

C23C28/00; C23C4/04; C23C10/48; C25D5/02; C25D5/12; C25D5/50; F01D5/28; F02C7/00

JP5905336B2	2016-04-20
JP3857690B2	2006-12-13
JP4753720B2	2011-08-24
JP2004035911A	2004-02-05
JP2005526907A	2005-09-08

MORI Koh-ichi (JP)

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