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Title:
HEAT-SENSITIVE RECORDING BODY
Document Type and Number:
WIPO Patent Application WO/2023/190315
Kind Code:
A1
Abstract:
[Problem] To provide a water-dispersible heat-sensitive recording body that includes a support and a heat-sensitive recording layer that is provided on the surface of the support and a heat-sensitive recording label that is formed by providing an adhesive layer on the reverse surface of the support from the heat-sensitive recording layer, the heat-sensitive recording body and the heat-sensitive recording label achieving, among a variety of desired characteristics, excellent reprintability as well as excellent wet heat resistance, plasticizer resistance, solvent resistance, and the like. [Solution] The present invention provides a heat-sensitive recording body and a heat-sensitive recording label. The heat-sensitive recording body includes a support and a heat-sensitive recording layer that is provided on the support and contains a colorless or lightly colored electron-donating leuco dye and an electron-accepting developer, the support comprising a water-dispersible paper substrate, and the heat-sensitive recording layer containing, as the electron-accepting developer, at least one type of urea compound represented by general formula (1). (In the formula, X represents -O- or -NH-, R1 represents a hydrogen atom or -SO2-R3, R3 represents a substituted or unsubstituted alkyl group, aralkyl group, or aryl group, R2 represents a hydrogen atom or an alkyl group, and m is 0 or 1.) 

Inventors:
HIRAI KENJI (JP)
KISHIMOTO MASAKI (JP)
YAMAMOTO MITSUYASU (JP)
Application Number:
PCT/JP2023/012160
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
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Assignee:
JUJO PAPER CO LTD (JP)
NIPPON PAPER PAPYLIA CO LTD (JP)
International Classes:
B41M5/40; B41M5/333; B41M5/41
Domestic Patent References:
WO2021095751A12021-05-20
WO2012014970A12012-02-02
Foreign References:
JP2021511982A2021-05-13
JP2018103469A2018-07-05
JP2007237634A2007-09-20
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
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