Title:
HEAT SENSOR
Document Type and Number:
WIPO Patent Application WO/2014/109114
Kind Code:
A1
Abstract:
The purpose of the present invention mainly is to secure the deformability of a bimetal with a simple configuration, while allowing for accurate positional control of the bimetal, making it possible to increase the response speed (heat response) of the bimetal. The present invention relates to a heat sensor (2) including a bimetal (3), a case (4), and a cover member (6).
A pressing member (21) for pressing the bimetal (3) against the bottom (17) of the case (4) is provided between the cover member (6) and the bimetal (3). The pressing member (21) is configured to be deformable in accordance with the deformation of the bimetal (3).
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Inventors:
KAMIYAMA NAOHISA (JP)
YOSHIOKA HIROKI (JP)
YOSHIOKA HIROKI (JP)
Application Number:
PCT/JP2013/079820
Publication Date:
July 17, 2014
Filing Date:
November 05, 2013
Export Citation:
Assignee:
CALSONIC KANSEI CORP (JP)
International Classes:
H01H37/54
Foreign References:
| JPH01502790A | 1989-09-21 | |||
| JPS5991650U | 1984-06-21 | |||
| JPH05314876A | 1993-11-26 | |||
| JPS5447079U | 1979-04-02 | |||
| JP2005322424A | 2005-11-17 |
Attorney, Agent or Firm:
NISHIWAKI, Tamio (JP)
Tamio Nishiwaki (JP)
Tamio Nishiwaki (JP)
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