Title:
HEAT-SHRINKABLE FILM
Document Type and Number:
WIPO Patent Application WO/2024/029522
Kind Code:
A1
Abstract:
This heat-shrinkable film comprises a first layer containing: at least one resin selected from a petroleum resin, a terpene-based resin, and a rosin-based resin; a propylene-based resin; a cyclic olefin-based resin; and an ethylene-based resin having 50 mol% or more of an ethylene component and a melting point of 70ºC or higher.
Inventors:
SHIMAZAKI IBUKI (JP)
TAKAICHI JUN (JP)
KAMEI KENSUKE (JP)
WATANABE NOBUHIRO (JP)
TAKAICHI JUN (JP)
KAMEI KENSUKE (JP)
WATANABE NOBUHIRO (JP)
Application Number:
PCT/JP2023/028088
Publication Date:
February 08, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
GUNZE KK (JP)
International Classes:
C08L23/10; B32B7/028; B32B27/32; B65D25/20; C08J5/18; C08L23/04; C08L45/00; C08L57/02; C08L65/00; C08L93/04; G09F3/04
Domestic Patent References:
| WO2005110746A1 | 2005-11-24 | |||
| WO2014080777A1 | 2014-05-30 |
Foreign References:
| JP2008525235A | 2008-07-17 | |||
| JP2006110827A | 2006-04-27 | |||
| JP2004181876A | 2004-07-02 | |||
| JP2001219503A | 2001-08-14 | |||
| JP2006027052A | 2006-02-02 | |||
| JP2022073171A | 2022-05-17 |
Attorney, Agent or Firm:
TACHIBANA, Kenji (JP)
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