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Title:
HEAT-SHRINKABLE LAMINATED FILM, AND MOLDED ARTICLES, HEAT-SHRINKABLE LABELS AND CONTAINERS, MADE BY USING THE FILM
Document Type and Number:
WIPO Patent Application WO/2006/051920
Kind Code:
A1
Abstract:
The invention provides a heat-shrinkable laminated film excellent in breakage resistance, stiffness, and shrink finish; and molded articles, heat-shrinkable labels, and containers, made by using the film. Specifically, a heat-shrinkable laminated film having a layer (A) constituted mainly of a polyester resin and a layer (B) constituted mainly of a polystyrene resin as the face and back layers or interlayers, in which the loss elasticity (EA') of the resin constituting the layer (A) exhibits at least one peak within the range of 50 to 90&ring C and the storage elastic moduli thereof at 0 to 40&ring C satisfy the relationship: EA'(0)/EA'(40) < 1.2, while the storage elastic moduli of the resin constituting the layer (B) at 50&ring C and 90&ring C satisfy the relationships: EB'(50) > 1.5 x 108 Pa and EB'(90) > 5.0 x 107 Pa respectively, with the storage elastic modulus curves of EA' and EB' crossing each other and which exhibits a heat shrinkage of 30 to 60% in the direction of main shrinkage after the immersion in warm water at 80&ring C for 10 seconds and a heat shrinkage of ±5% or below in the direction perpendicular thereto in the range of 70 to 80&ring C.

Inventors:
HIRUMA TAKASHI (JP)
YAMADA TAKEYOSHI (JP)
TANAKA YUKIHIRO (JP)
MIYASHITA YOU (JP)
TAKAGI JYUN (JP)
Application Number:
PCT/JP2005/020754
Publication Date:
May 18, 2006
Filing Date:
November 11, 2005
Export Citation:
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Assignee:
MITSUBISHI PLASTICS INC (JP)
HIRUMA TAKASHI (JP)
YAMADA TAKEYOSHI (JP)
TANAKA YUKIHIRO (JP)
MIYASHITA YOU (JP)
TAKAGI JYUN (JP)
International Classes:
B32B27/30; B29C61/06; B32B7/022; B32B7/027; B32B27/36; B65D25/36; B65D65/40; G09F3/04
Foreign References:
JP2002351332A2002-12-06
JPS6141542A1986-02-27
JP2004091712A2004-03-25
JP2002052672A2002-02-19
JPH11138708A1999-05-25
Other References:
See also references of EP 1810821A4
Attorney, Agent or Firm:
Hoshino, Tetsuro c/o Tokyo, Central Patent Firm (4th Floor Oak Building Kyobashi, 16-10, Kyobashi 1-chom, Chuou-ku Tokyo 31, JP)
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