Title:
HEAT SINK FOR POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2023/090646
Kind Code:
A1
Abstract:
Disclosed is a heat sink for a power module, which provides further enhanced cooling performance. The disclosed heat sink for a power module comprises: a body part that is open at the top thereof and has an inlet through which cooling water is introduced and an outlet through which the cooling water is discharged; a first flow channel which is formed in the body part and through which the cooling water flows; an upper cap that is coupled to the top of the body part and has an upper surface on which a power module is disposed; and a heat dissipation pattern that is formed at the lower surface of the upper cap and is inserted into the first flow channel.
Inventors:
YOON SANG WON (KR)
PYUN SUNG HYUN (KR)
PYUN SUNG HYUN (KR)
Application Number:
PCT/KR2022/015265
Publication Date:
May 25, 2023
Filing Date:
October 11, 2022
Export Citation:
Assignee:
IUCF HYU (KR)
International Classes:
H05K7/20; H01L23/367; H01L23/473; H01L25/07
Foreign References:
| KR20210085730A | 2021-07-08 | |||
| KR101132409B1 | 2012-04-03 | |||
| KR20130131603A | 2013-12-04 | |||
| KR20140085011A | 2014-07-07 | |||
| KR20180094700A | 2018-08-24 |
Attorney, Agent or Firm:
MIN, Young Joon (KR)
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