HEAT TRANSFER STRUCTURE AND MANUFACTURING METHOD THEREFOR

Title:

HEAT TRANSFER STRUCTURE AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2016/208690

Kind Code:

A1

Abstract:

Provided are a heat transfer structure excellent in heat transfer efficiency, and a manufacturing method therefor. The heat transfer structure according to the present invention includes: a first heat conductive material in which a heat conductivity in the plain direction is higher than a heat conductivity in a direction perpendicular to the plain direction; and a second heat conductive material which is fitted, in the perpendicular direction, in a through hole in the first heat conductive material. The second heat conductive material is held by the inner surface of the through hole, and has a fitting strength of 0.5 N/mm or greater per unit circumferential length of the through hole.

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Inventors:

OKU SATOSHI (JP)
KUTSUMIZU MAKOTO (JP)
NISHIKAWA YASUSHI (JP)

Application Number:

PCT/JP2016/068723

Publication Date:

December 29, 2016

Filing Date:

June 23, 2016

Export Citation:

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Assignee:

KANEKA CORP (JP)

International Classes:

H01L23/373; H01L23/36; H05K7/20

Foreign References:

JP2007129201A	2007-05-24
JP3122382U	2006-06-08

Other References: