Title:
HEAT TRANSFER UNIT AND TEMPERATURE ADJUSTMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/157417
Kind Code:
A1
Abstract:
Provided is a temperature adjustment device having excellent quietness. A temperature adjustment device is provided with: at least one first Peltier unit (110) which has a heat absorption surface and a heat release surface; at least one second Peltier unit (120) which has a heat absorption surface and a heat release surface; a controller (130) which controls the drive currents of the first Peltier unit and the second Peltier unit; a primary circulation mechanism which circulates a primary refrigerant between a first heat release block (140) and a heat absorption block; at least one second heat release block (160) which has a flow path through which a secondary refrigerant flows, receives heat from the heat release surface of the second Peltier unit (120) and transmits the heat to the secondary refrigerant; a heat exchanger (190) which receives the secondary refrigerant discharged from the second heat release block (160) and releases heat; and a secondary circulation mechanism which circulates the secondary refrigerant between the second heat release block (160) and the heat exchanger (190).
Inventors:
TACHIBANA JUNICHI (JP)
IWASAKI SHINICHIRO (JP)
IWASAKI SHINICHIRO (JP)
Application Number:
PCT/JP2013/060514
Publication Date:
October 24, 2013
Filing Date:
April 05, 2013
Export Citation:
Assignee:
KEENUSDESIGN CORP (JP)
International Classes:
F25B21/02
Domestic Patent References:
WO2009150725A1 | 2009-12-17 |
Foreign References:
JPH11173701A | 1999-07-02 | |||
JP2008514895A | 2008-05-08 | |||
JP2002314154A | 2002-10-25 | |||
JP2001336854A | 2001-12-07 | |||
JP2000124509A | 2000-04-28 | |||
JPS3819240B1 | ||||
JPH11186617A | 1999-07-09 |
Attorney, Agent or Firm:
ORISAKA SHIGEKI (JP)
折坂 Shigeki (JP)
折坂 Shigeki (JP)
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