Title:
HEAT TREATMENT DEVICE, METHOD, AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/134101
Kind Code:
A1
Abstract:
Embodiments of the present disclosure provide a heat treatment device, method, and apparatus. The heat treatment device comprises: a heat treatment chamber; a heating assembly, which is located in the heat treatment chamber for use in heating a wafer in the heat treatment chamber; a carrying assembly, which is located in the heat treatment chamber for use in carrying the wafer; a temperature supplementing assembly, which uses a light source to heat an area of the surface of the wafer to undergo temperature supplementation; and a control assembly, which is electrically connected to the heating assembly and which is used to control the switching on and off of the heating assembly and the magnitude of output power of the heating assembly. The control assembly is electrically connected to the temperature supplementing assembly and is used to control the switching on and off of the temperature supplementing assembly.
Inventors:
LU QIUJIE (CN)
Application Number:
PCT/CN2022/094091
Publication Date:
July 20, 2023
Filing Date:
May 20, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L21/67
Foreign References:
| US20040018008A1 | 2004-01-29 | |||
| US20120067864A1 | 2012-03-22 | |||
| US4698486A | 1987-10-06 | |||
| US20180340835A1 | 2018-11-29 | |||
| CN103779195A | 2014-05-07 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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