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Patent Searching and Data


Title:
HEATSINK
Document Type and Number:
WIPO Patent Application WO/2019/026952
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the heat exchange performance of a heatsink. The heatsink includes: a substrate portion; a plurality of plate-like fin portions which rise integrally from a surface of the substrate portion and are arranged mutually in parallel, forming groove portions therebetween; and a porous body portion comprising at least one porous body with which the groove portions between the fin portions are filled and which has a three-dimensional mesh structure. The substrate portion and the fin portions comprise a solid non-porous material of aluminum. The porous body portion comprises a sintered body of aluminum fiber. The porous body portion is joined to the fin portions and the substrate portion via a sintered joint portion.

Inventors:
WATANABE KOTARO (JP)
SAIWAI TOSHIHIKO (JP)
Application Number:
PCT/JP2018/028835
Publication Date:
February 07, 2019
Filing Date:
August 01, 2018
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/36; H01L23/40
Domestic Patent References:
WO2014045714A12014-03-27
Foreign References:
JP2016194118A2016-11-17
JP2012009482A2012-01-12
JP2011007365A2011-01-13
JP2003037226A2003-02-07
JP2017149843A2017-08-31
JPH06244327A1994-09-02
JP2007184366A2007-07-19
JP2012009482A2012-01-12
JP2012014508A2012-01-19
Other References:
See also references of EP 3664132A4
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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