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Title:
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/138514
Kind Code:
A1
Abstract:
The present invention lowers the profile of a high frequency module. A high frequency module (100) is provided with a mounting substrate (9), a first electronic component (1), and a second electronic component (2). The mounting substrate (9) has a first main surface (91) and a second main surface (92) opposing each other. The first electronic component (1) is mounted on the first main surface (91) of the mounting substrate (9). The second electronic component (2) is disposed over the first electronic component (1). The first main surface (91) of the mounting substrate (9) has a recess (911). The first electronic component (1) is mounted in the recess (911) of the first main surface (91) of the mounting substrate (9).

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Inventors:
HAYAKAWA MASASHI
Application Number:
PCT/JP2021/046880
Publication Date:
June 30, 2022
Filing Date:
December 17, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/18; H01L23/00; H01L23/12; H01L23/28; H01L25/04; H01L25/065; H01L25/07; H03H9/25; H04B1/00; H04B1/38; H05K1/18
Domestic Patent References:
WO2006095852A12006-09-14
Foreign References:
JP2004296613A2004-10-21
JP2004214258A2004-07-29
JP2020102693A2020-07-02
JP2020102758A2020-07-02
JP2005050868A2005-02-24
JP2006253576A2006-09-21
JP2004214249A2004-07-29
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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