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Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/168500
Kind Code:
A1
Abstract:
A high frequency module (10) is provided with: a filter unit (20) which includes a plurality of filters; a switch unit (30) which is connected to the filter unit (20), and which includes a switch for switching a filter among the plurality of filters that passes a high frequency signal; an amplification unit (50) which amplifies the high frequency signal that passes through the filter unit (20); a matching unit (40) which is connected between the filter unit (20) and the amplification unit (50), and which performs impedance matching for the amplification unit (50); and a multilayer substrate (100) on which the filter unit (20), the switch unit (30), the amplification unit (50), and the matching unit (40) are disposed. The matching unit (40) is disposed on one major surface (101) of the multilayer substrate (100). The amplification unit (50) is disposed on another major surface (102) of the multilayer substrate (100) or in an inner layer thereof. The switch unit (30) is disposed on the one major surface (101) or in the inner layer different from the other major surface (102) or the inner layer where the amplification unit (50) is disposed.

Inventors:
KITA TERUMICHI (JP)
Application Number:
PCT/JP2018/007822
Publication Date:
September 20, 2018
Filing Date:
March 01, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/401; H01L25/04; H01L25/18; H03H7/46; H04B1/00
Domestic Patent References:
WO2006035518A12006-04-06
WO2017033564A12017-03-02
Foreign References:
JP2006295956A2006-10-26
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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