HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2019/044704

A1

A high frequency module (10) comprises: a first common terminal (S0) to which an RF reception signal is input; a first switch (151) that includes a first to-be-selected terminal (S1) and a second to-be-selected terminal (S2), which are electrically connected to the first common terminal (S0), and that switches the connection between the first common terminal (S0) and the first to-be- selected terminal (S1) and the connection between the first common terminal (S0) and the second to-be-selected terminal (S2); a low noise amplifier (152) that amplifies the RF reception signal; a first signal path (P1) which is connected to the first to-be-selected terminal (S1) and which passes through the low noise amplifier (152); a second signal path (P2) which is connected to the second to-be-selected terminal (S2) and which does not pass through the low noise amplifier (152); a first output terminal (Rx1) that outputs the amplified RF reception signal to an RF signal processing circuit (30); and a second output terminal (Rx2) that is a different output terminal from the first output terminal (Rx1) and that outputs the RF reception signal to the RF signal processing circuit (30).

WO/2022/037579	RADIO-FREQUENCY SIGNAL PROCESSING METHOD AND APPARATUS, AND ELECTRONIC DEVICE
WO/2021/172849	DUAL CONNECTION CIRCUIT AND ELECTRONIC DEVICE INCLUDING SAME
WO/2021/249198	COMMUNICATION SYSTEM, COMMUNICATION METHOD, AND COMPUTER STORAGE MEDIUM

HONDA AKIFUMI (JP)

PCT/JP2018/031367

March 07, 2019

August 24, 2018

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MURATA MANUFACTURING CO (JP)

H04B1/401; H04B1/00; H04B1/50

JP2012156878A	2012-08-16
JPH1084300A	1998-03-31

YOSHIKAWA, Shuichi et al. (JP)

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