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Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181589
Kind Code:
A1
Abstract:
This high-frequency module (1) is provided with: a mounting board (30) which can be connected to an external board (90) and has a main surface (30a) and a main surface (30b) that face each other; a plurality of ground terminals (411 and 412) which electrically connect the mounting board (30) and the external board (90); a PA (11) mounted on the main surface (30a); and an LNA (21) mounted on the main surface (30b).

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Inventors:
MATSUMOTO SHO (JP)
Application Number:
PCT/JP2019/009578
Publication Date:
September 26, 2019
Filing Date:
March 11, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H01L25/00; H01L25/065; H01L25/07; H01L25/18; H04B1/38
Domestic Patent References:
WO2018043162A12018-03-08
Foreign References:
JP2005150443A2005-06-09
JP2001210752A2001-08-03
JP2010161812A2010-07-22
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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