Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/240096
Kind Code:
A1
Abstract:
This high-frequency module (1) comprises: a module board (91); a transmission power amplifier (11); an inductor (31L) which is mounted on a principal surface (91a) and is connected to the output terminal of the transmission power amplifier (11); a reception low-noise amplifier (21); and an inductor (41L) which is mounted on the principal surface (91a) and which is connected to an input terminal of the reception low-noise amplifier (21). If the module board (91) is viewed in plan view, an electro-conductive member mounted to the principal surface (91a) is positioned between the inductor (31L) and the inductor (41L).
Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2019/022986
Publication Date:
December 19, 2019
Filing Date:
June 10, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/46; H04B1/00; H04B1/50
Domestic Patent References:
| WO2018088410A1 | 2018-05-17 | |||
| WO2017006866A1 | 2017-01-12 |
Foreign References:
| JP2010183590A | 2010-08-19 | |||
| US20100253435A1 | 2010-10-07 | |||
| JP2009130006A | 2009-06-11 | |||
| US20090130999A1 | 2009-05-21 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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