Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/039083
Kind Code:
A1
Abstract:
This high-frequency module (1) comprises: a substrate (91); a power amplifier (11) that amplifies a transmission signal of a first communication band; a power amplifier (12) that amplifies a transmission signal of a second communication band; and a power amplifier (13) that amplifies a transmission signal of a third communication band, wherein simultaneous transmission is available in a combination of the first communication band and the third communication band, and simultaneous transmission is unavailable in a combination of the first communication band and the second communication band and a combination of the second communication band and the third communication band. In a plan view of the substrate (91), a distance (Dp13) between the output terminals of the power amplifier (11) and the power amplifier (13) is larger than a distance (Dp12) between the output terminals of the power amplifier (11) and the power amplifier (12) and a distance (Dp23) between the power amplifier (12) and the power amplifier (13).
Inventors:
TSUDA MOTOJI (JP)
Application Number:
PCT/JP2020/025027
Publication Date:
March 04, 2021
Filing Date:
June 25, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H04B1/38
Domestic Patent References:
| WO2019044704A1 | 2019-03-07 | |||
| WO2019065311A1 | 2019-04-04 | |||
| WO2019188968A1 | 2019-10-03 |
Foreign References:
| JP2017028699A | 2017-02-02 | |||
| JP2006166277A | 2006-06-22 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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