Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/091830
Kind Code:
A1
Abstract:
This high-frequency module (1A) is capable of simultaneously transmitting a first transmission signal and a second transmission signal, and is provided with: a module substrate (91); a power amplifier (11) that is positioned on the module substrate (91), the power amplifier (11) amplifying a high-frequency signal and outputting the first transmission signal; a power amplifier (12) that is positioned on the module substrate (91), the power amplifier (12) amplifying a high-frequency signal and outputting the second transmission signal; a temperature sensor (51) positioned on the module substrate (91); and a PA control circuit (50) that is positioned on the module substrate (91) and that controls the amplification operations of the power amplifiers (11 and 12) in accordance with the measurement value of the temperature sensor (51). The maximum output power of the power amplifier (11) is greater than the maximum output power of the power amplifier (12), and the distance (Ds1) between the temperature sensor (51) and the power amplifier (11) is less than or equal to the distance (Ds2) between the temperature sensor (51) and the power amplifier (12).
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Inventors:
TSUDA MOTOJI (JP)
NAKAMURA HAYATO (JP)
NAKAMURA HAYATO (JP)
Application Number:
PCT/JP2021/038369
Publication Date:
May 05, 2022
Filing Date:
October 18, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/036; H04B1/04; H04B1/38
Foreign References:
| JP2012222702A | 2012-11-12 | |||
| JP2020057992A | 2020-04-09 | |||
| JP2005080228A | 2005-03-24 | |||
| JPS5887923A | 1983-05-25 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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