Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/153767
Kind Code:
A1
Abstract:
A high-frequency module (1) equipped with a module substrate (91) having main surfaces (91a, 91b) which oppose one another, also equipped with a plurality of post electrodes (150) arranged on the main surface (91b), and further equipped with a power amplification component (10) positioned on the main surface (91b), wherein the power amplification component (10) is equipped with: a substrate (101) having main surfaces (101a, 101b) which oppose one another and are positioned in a manner such that the main surface (101a) is located between the main surface (91b) and the main surface (101b); an amplification transistor (110) formed on the substrate (101) on the main surface (101b) side thereof; and a metal electrode (102) connected to the amplification transistor (110) and positioned on the main surface (101b).
Inventors:
YAMAGUCHI YUKIYA (JP)
Application Number:
PCT/JP2021/046243
Publication Date:
July 21, 2022
Filing Date:
December 15, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/10; H01L25/18; H03F3/24; H04B1/00; H04B1/38
Domestic Patent References:
| WO2018101384A1 | 2018-06-07 | |||
| WO2021002296A1 | 2021-01-07 |
Foreign References:
| JP2011124366A | 2011-06-23 | |||
| JP2002359327A | 2002-12-13 | |||
| JP2020126921A | 2020-08-20 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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