Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/153768
Kind Code:
A1
Abstract:
This high-frequency module (1) is provided with a module substrate (91) having two opposite main surfaces (91a and 91b), a resin member (92a) covering at least part of the main surface (91a), a shield electrode layer (93) covering at least part of a surface of the resin member (92a), a plurality of post electrodes (150) arranged on the main surface (91b), a power-amplifying component (10) arranged on the main surface (91b), and a first metal electrode (e.g., a shield electrode layer (941)). The power-amplifying component (10) has two opposite main surfaces (101a and 101b), the main surface (101b) is provided with a base material positioned between the main surface (91b) and the main surface (101b) and an amplifying transistor (110) formed on the base material (101), and the first metal electrode is arranged on the main surface (101b) in contact with the shield electrode layer (93).
Inventors:
YAMAGUCHI YUKIYA (JP)
Application Number:
PCT/JP2021/046245
Publication Date:
July 21, 2022
Filing Date:
December 15, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H01L25/10; H01L25/18; H03F3/24; H04B1/00; H04B1/38
Domestic Patent References:
| WO2018101384A1 | 2018-06-07 | |||
| WO2021002296A1 | 2021-01-07 |
Foreign References:
| JP2011124366A | 2011-06-23 | |||
| JP2020126921A | 2020-08-20 | |||
| JP2003100937A | 2003-04-04 | |||
| JP2002329833A | 2002-11-15 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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