HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2022/209731

A1

A high-frequency module (1A) comprises: a module substrate (91) having main surfaces (91a and 91b) that are opposite each other; a module substrate (92) having main surfaces (92a and 92b) that are opposite each other, the main surface (92a) being disposed so as to face the main surface (91b); a plurality of electronic components provided between the main surfaces (91b and 92a), on the main surface (91a), and on the main surface (92b); and a plurality of external connection terminals (150) disposed on the main surface (92b). The plurality of electronic components include a power amplifier (11). The power amplifier (11) has main surfaces (11a and 11b) that are opposite each other, and a circuit part that includes an amplifying transistor and is formed at a location nearer to the main surface (11a) than the main surface (11b). The main surface (11a) of the power amplifier (11) is disposed so as to face the main surface (91b), and the main surface (11b) is joined to a heat-dissipating conductor (150t) that extends in a direction heading from the main surface (92a) toward the main surface (92b).

DAIMON YOSHIHIRO (JP)
KITAJIMA HIROMICHI (JP)
AIKAWA KIYOSHI (JP)
YAMADA TAKASHI (JP)
UEJIMA TAKANORI (JP)

PCT/JP2022/010801

October 06, 2022

March 11, 2022

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MURATA MANUFACTURING CO (JP)

H01L25/00; H03F3/24; H03H9/25; H04B1/00; H04B1/38; H05K3/46

WO2020022180A1	2020-01-30
WO2020090557A1	2020-05-07
WO2021002156A1	2021-01-07
WO2021039076A1	2021-03-04
WO2021044691A1	2021-03-11

JP2016103540A	2016-06-02
JP2003060523A	2003-02-28

YOSHIKAWA, Shuichi et al. (JP)

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