Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209741
Kind Code:
A1
Abstract:
A high-frequency module (1A) comprises: a module substrate (91) having main surfaces (91a, 91b) that are opposite each other; a module substrate (92) having main surfaces (92a, 92b) that are opposite each other, the main surface (92a) being disposed facing the main surface (91b); a plurality of electronic components provided between the main surfaces (91b, 92a), on the main surface (91a), and on the main surface (92b); and a plurality of external connection terminals (150) disposed on the main surface (92b). The plurality of electronic components include a power amplifier (11). The power amplifier (11) includes: main surfaces (11a, 11b) that are opposite each other; and a circuit that includes an amplifying transistor and that is formed at a location closer to the main surface (11a) than to the main surface (11b). The power amplifier (11) is configured so that the main surface (11a) is disposed facing the main surface (92a), and the main surface (11b) is disposed facing the main surface (91b). A heat-dissipating conductor (150t) is joined to the main surface (11a).
Inventors:
AIKAWA KIYOSHI (JP)
KITAJIMA HIROMICHI (JP)
YAMADA TAKASHI (JP)
DAIMON YOSHIHIRO (JP)
UEJIMA TAKANORI (JP)
KITAJIMA HIROMICHI (JP)
YAMADA TAKASHI (JP)
DAIMON YOSHIHIRO (JP)
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2022/010819
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H03F3/24; H04B1/00; H04B1/38; H05K3/46
Domestic Patent References:
| WO2020090557A1 | 2020-05-07 | |||
| WO2020071021A1 | 2020-04-09 | |||
| WO2020022180A1 | 2020-01-30 | |||
| WO2019244816A1 | 2019-12-26 |
Foreign References:
| JP2021048567A | 2021-03-25 | |||
| JP2005203633A | 2005-07-28 | |||
| JP2002359327A | 2002-12-13 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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