Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209742
Kind Code:
A1
Abstract:
A high-frequency module (1A) includes: a module substrate (91) having main surfaces (91a and 91b) on the reverse sides from each other; a module substrate (92) having main surfaces (92a and 92b) on the reverse sides from each other, the main surface (92a) facing the main surface (91b); multiple external connection terminals (150) disposed on the main surface (92b); multiple inter-substrate connection terminals (151) disposed between the main surfaces (91b and 92a) to connect the module substrate (91) and the module substrate (92); a first electronic component (integrated circuit (70)) including a switch (52); a second electronic component including a filter (61) connected to a power amplifier (11) via the switch (52); and a third electronic component including a filter (62) connected to the power amplifier (11) via the switch (52), wherein the first electronic component, the second electronic component, and the third electronic component are arranged on the same module substrate.
Inventors:
AIKAWA KIYOSHI (JP)
UEJIMA TAKANORI (JP)
KITAJIMA HIROMICHI (JP)
YAMADA TAKASHI (JP)
DAIMON YOSHIHIRO (JP)
UEJIMA TAKANORI (JP)
KITAJIMA HIROMICHI (JP)
YAMADA TAKASHI (JP)
DAIMON YOSHIHIRO (JP)
Application Number:
PCT/JP2022/010824
Publication Date:
October 06, 2022
Filing Date:
March 11, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H04B1/38; H01L25/00; H01L25/065; H01L25/07; H01L25/18; H04B1/00
Domestic Patent References:
| WO2019181589A1 | 2019-09-26 | |||
| WO2020022180A1 | 2020-01-30 | |||
| WO2020071020A1 | 2020-04-09 | |||
| WO2021002159A1 | 2021-01-07 | |||
| WO2019065311A1 | 2019-04-04 | |||
| WO2020261777A1 | 2020-12-30 |
Foreign References:
| US20200343930A1 | 2020-10-29 | |||
| JP2020126921A | 2020-08-20 | |||
| JP2020027974A | 2020-02-20 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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