HIGH-FREQUENCY THREE-LEVEL DCDC CONVERTER MODULE AND ASSEMBLY METHOD THEREFOR

WIPO Patent Application WO/2023/050506

A1

A high-frequency three-level DCDC converter module and an assembly method therefor. The converter module comprises a heat sink (10), wherein a semiconductor device (12) is mounted on a surface of the heat sink (10); a composite busbar (20), a capacitor component (30) and a control component (40) are sequentially provided in a direction perpendicular to and away from the surface where the semiconductor device (12) is located; the composite busbar (20) covers the semiconductor device (12); the capacitor component (30) comprises a capacitor support (31) for installation of a capacitor (32); and the bottom of the capacitor support (31) is fixed to the heat sink (10), and the top thereof supports the control component (40). In the high-frequency three-level DCDC converter module, a layered layout structure, which is stacked in sequence in a direction perpendicular to the surface of the heat sink (10), is used, and different functional units are distributed on different layers and are clearly arranged in layers to reduce mutual interference therebetween; and modularization of the functional units can be achieved, which greatly increases a one-time assembly success rate, facilitates the operation of a production line, and improves the production efficiency.

RAO PEINAN (CN)
ZHOU SHUAI (CN)
SONG SEN (CN)
YI TAO (CN)
ZHAO QINGLIANG (CN)
GENG ZHIDONG (CN)
XIE WEI (CN)
YAN XU (CN)
YANG HAO (CN)
ZHANG YUNHAN (CN)

PCT/CN2021/126441

April 06, 2023

October 26, 2021

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ZHUZHOU CRRC TIMES ELECTRIC CO LTD (CN)

H02M1/00

CN204349819U	2015-05-20
CN104734467A	2015-06-24
CN214205363U	2021-09-14
CN211127537U	2020-07-28
CN203482085U	2014-03-12
JP2010187504A	2010-08-26

YUHONG INTELLECTUAL PROPERTY LAW FIRM (CN)

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