Title:
HIGH-FREQUENCY WIRING STRUCTURE, HIGH-FREQUENCY MOUNTING SUBSTRATE, METHOD FOR PRODUCING HIGH-FREQUENCY WIRING STRUCTURE, AND METHOD FOR SHAPING WAVEFORM OF HIGH-FREQUENCY SIGNAL
Document Type and Number:
WIPO Patent Application WO/2013/183317
Kind Code:
A1
Abstract:
[Problem] To appropriately shape the waveform of a signal even in cases where the wiring length of a wiring pattern is long. [Solution] This high-frequency wiring structure (1) comprises a branched wiring pattern (3) that is formed by being branched from a predetermined location of a main wiring pattern (2) corresponding to a transmission line over which a high-frequency signal is transmitted. The branched wiring pattern (3) is made by continuously joining together a plurality of segments each having an individually set characteristic impedance and segment length. The specific characteristic impedances and segment lengths of the branched wiring pattern (3) are determined such that reflected waves generated at the boundaries between two adjacent segments in the branched wiring pattern are superimposed upon the signal on the main wiring pattern, and that the waveform of the high-frequency signal propagating through the transmission line is shaped at an observation point on the transmission line.
Inventors:
YASUNAGA MORITOSHI (JP)
Application Number:
PCT/JP2013/052016
Publication Date:
December 12, 2013
Filing Date:
January 30, 2013
Export Citation:
Assignee:
UNIV TSUKUBA (JP)
International Classes:
H04L25/03; H05K1/02; H05K3/00
Foreign References:
| JP2005150644A | 2005-06-09 | |||
| JP2003134177A | 2003-05-09 | |||
| JP2008160389A | 2008-07-10 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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