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Patent Searching and Data


Title:
HIGH-PURITY 1-FLUOROBUTANE AND PLASMA ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/203842
Kind Code:
A1
Abstract:
The present invention provides: high-purity 1-fluorobutane characterized by having a purity of 99.9% by vol or more and containing butene compounds in the total amount of 1000 ppm by volume or less; the use of the high-purity 1-fluorobutane as a dry etching gas; and a plasma etching method using the high-purity 1-fluorobutane as an etching gas. According to the present invention, high-purity 1-fluorobutane which is suitable as a plasma reaction gas for semiconductors, the use of the high-purity 1-fluorobutane as a dry etching gas, and a plasma etching method using the high-purity 1-fluorobutane as an etching gas are provided.

Inventors:
SUGIMOTO TATSUYA (JP)
Application Number:
PCT/JP2014/065847
Publication Date:
December 24, 2014
Filing Date:
June 16, 2014
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C07C19/08; C07C17/383; C07C17/389; H01L21/3065
Domestic Patent References:
WO2009123038A12009-10-08
WO2009123038A12009-10-08
Foreign References:
JP2013006786A2013-01-10
JP2014024785A2014-02-06
US20110068086A12011-03-24
JP2013006786A2013-01-10
JP2014024785A2014-02-06
JP2012165797A2012-09-06
Other References:
KAGAKU DAIJITEN, vol. 7, 30 October 1961 (1961-10-30), pages 878, XP008182590
TETRAHEDRON, vol. 29, 1973, pages 1877
JOURNAL OF FLUORINE CHEMISTRY, vol. 73, 1995, pages 185
See also references of EP 3012241A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
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