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Title:
HIGH-STRENGTH ELECTROMAGNETIC SHIELDING COPPER ALLOY AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/207943
Kind Code:
A1
Abstract:
The present disclosure relates to a high-strength electromagnetic shielding copper alloy and a preparation method therefor, and belongs to the technical field of copper alloys. The alloy comprises the following chemical components in percentages by mass: 3-9% of Fe, 2-5% of Ni, 0.2-0.5% of Al, and 0.01-0.20% of a rare-earth metal, with the balance being Cu and inevitable impurities. In the present disclosure, by adding different alloying elements, the solubility of iron in the copper alloy is effectively improved, such that the strength and the electromagnetic shielding performance of the copper alloy are improved; therefore, a high-strength electromagnetic shielding copper alloy having an electromagnetic shielding performance greater than 110 dB, conductivity greater than 50% IACS, and tensile strength greater than 950 MPa is obtained.

Inventors:
LI DONGSHENG (CN)
LIU DAN (CN)
CHEN KAIBIN (CN)
ZHANG XUGUI (CN)
ZHANG YANAN (CN)
ZHANG FENPING (CN)
WANG HUIYAO (CN)
Application Number:
PCT/CN2023/090491
Publication Date:
November 02, 2023
Filing Date:
April 25, 2023
Export Citation:
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Assignee:
ALUMINUM CORP CHINA LTD (CN)
International Classes:
C22C1/02; C22C9/00; C22F1/08
Foreign References:
CN114717435A2022-07-08
JP2000256766A2000-09-19
CN101709400A2010-05-19
CN103388090A2013-11-13
CN105671356A2016-06-15
JP2012207275A2012-10-25
Attorney, Agent or Firm:
BEIJING BRIGHT & RIGHT LAW FIRM (CN)
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