Title:
HIGH-THROUGHPUT THIN-FILM FABRICATION VACUUM FLANGE
Document Type and Number:
WIPO Patent Application WO2003032371
Kind Code:
A3
Abstract:
A mechanism and methodology is provided for performing high-throughput thin-film., experimentation with the use and integration of a heater. A single flange assembly contains an automated two-dimensional shutter system (Fig. 2) (which provides variable masking schemes for spatially selective shadow deposition) and a rotatable (indexed) chip/wafer/substrate heater (50). The automated two-dimensional shutter system comprises two shutter plate mounts that move in two perpendicular (x and y) directions, so that mounted shutters overlap with each other in certain regions. The substrate heater can be used in the gradient temperature mode or uniform temperature mode. The shutter plates and the heater plate are detachable and exchangeable from experiment to experiment in order to minimize cross contamination of materials.
Inventors:
TAKEUCHI ICHIRO (US)
WOOD RUSSELL W (US)
VISPUTE RATNAKAR D (US)
WOOD RUSSELL W (US)
VISPUTE RATNAKAR D (US)
Application Number:
PCT/US2002/032431
Publication Date:
November 20, 2003
Filing Date:
October 11, 2002
Export Citation:
Assignee:
UNIV MARYLAND (US)
TAKEUCHI ICHIRO (US)
WOOD RUSSELL W (US)
VISPUTE RATNAKAR D (US)
TAKEUCHI ICHIRO (US)
WOOD RUSSELL W (US)
VISPUTE RATNAKAR D (US)
International Classes:
C23C14/02; C23C14/04; C23C14/28; (IPC1-7): H01L21/00
Foreign References:
| US6522390B2 | 2003-02-18 | |||
| US6045671A | 2000-04-04 |
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