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Title:
HIGHLY ADHESIVE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED FROM SAME, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/125688
Kind Code:
A1
Abstract:
[Problem] To provide: a molded article which enables the production of a molded article having flexibility, excellent mechanical properties and excellent adhesivity to a polar polymer and also enables the production of a laminate, and which is highly stable after being adhered to an object of interest; and a laminate. [Solution] A highly adhesive resin composition comprising: a polyvinyl acetal which has an acetalization degree of 50 to 85 mol%, a vinyl ester monomer unit content of 0.1 to 20 mol% and a viscosity average polymerization degree of 200 to 5000, and which has such a property that, when the polyvinyl acetal is heated at 230ºC for three hours and is then subjected to a gel permeation chromatographic measurement, the peak top molecular weight (A) as measured using a differential refractive index detector and the peak top molecular weight (B) as measured using an absorbance detector (a wavelength employed for measurement: 280 nm) satisfy the following formula (1): (A-B)/A < 0.60, wherein the absorbance at the peak top molecular weight (B) is 0.50 × 10-3 to 1.00 × 10-2; and a thermoplastic resin selected from polyester, polyamide, an α-olefin (co)polymer, a cellulose-type resin, an acrylic resin and a styrene-type resin.

Inventors:
SHIMAZUMI YUHI (JP)
KUSUDOU TAKESHI (JP)
TOKUCHI KAZUKI (JP)
ASANUMA YOSHIAKI (JP)
Application Number:
PCT/JP2015/053844
Publication Date:
August 27, 2015
Filing Date:
February 12, 2015
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08L29/14; B32B27/30; C08L101/00
Domestic Patent References:
WO2008050738A12008-05-02
WO2009081877A12009-07-02
Foreign References:
JP5420808B12014-02-19
JP5420804B12014-02-19
JP5469286B12014-04-16
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