Title:
HOLLOW PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/199375
Kind Code:
A1
Abstract:
A hollow package according to the present disclosure comprises: a device substrate; a lid substrate provided above the device substrate; a first sealing ring provided on the upper surface of the device substrate; a second sealing ring provided on the lower surface of the lid substrate that faces the device substrate, such that the second sealing ring faces the first sealing ring; a seal layer for joining the first sealing ring and the second sealing ring; and a functional element provided in a hollow portion surrounded by the device substrate, the lid substrate, the first sealing ring, the second sealing ring, and the seal layer, wherein the first sealing ring or the second sealing ring has a corner portion as seen in plan view, and a recess that is recessed in a direction perpendicular to the upper surface of the device substrate is formed in a localized manner in a portion including the corner portion of the first sealing ring or the second sealing ring.
Inventors:
MISAKI KOJI (JP)
Application Number:
PCT/JP2022/017500
Publication Date:
October 19, 2023
Filing Date:
April 11, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B81B7/00
Foreign References:
| JP2016531421A | 2016-10-06 | |||
| US20210276859A1 | 2021-09-09 | |||
| US10314171B1 | 2019-06-04 | |||
| JP2020175500A | 2020-10-29 | |||
| JP2006173557A | 2006-06-29 | |||
| JP2019155566A | 2019-09-19 | |||
| JP2020076782A | 2020-05-21 |
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
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