Title:
HOLLOW PARTICLES, RESIN COMPOSITION, RESIN MOLDED BODY, RESIN COMPOSITION FOR SEALING, CURED PRODUCT AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/228964
Kind Code:
A1
Abstract:
The present invention provides hollow particles which have a reduced dielectric loss tangent, while having improved performance stability in a high humidity environment. The present invention provides hollow particles each of which comprises a shell that contains a resin and a hollow part that is surrounded by the shell, wherein: the void fraction is 50% or more; the shell contains a polymer as the resin; the content of crosslinkable monomer units in 100% by mass of all monomer units of the polymer is 60% by mass or more; the content of a surfactant that is present on the surfaces of the hollow particles is 200 ppm or less; and with respect to an aqueous dispersion of the hollow particles obtained by dispersing the hollow particles in a volume of 0.35 cm3 in 100 mL of an ion exchange water, the pH is 6.5 to 7.5 and the conductivity is 50 µS/cm or less.
More Like This:
| JPH07273252 | SEMICONDCUTOR DEVICE |
| JP2024031388 | semiconductor equipment |
| JP2003218407 | OPTICAL SEMICONDUCTOR DEVICE |
Inventors:
MORIMURA MIKI (JP)
FUJIMURA MAKOTO (JP)
FUJIMURA MAKOTO (JP)
Application Number:
PCT/JP2023/019246
Publication Date:
November 30, 2023
Filing Date:
May 24, 2023
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
H01L23/29; C08F212/36; C08L25/02; H01L23/31
Domestic Patent References:
| WO2021112117A1 | 2021-06-10 | |||
| WO2022092076A1 | 2022-05-05 |
Foreign References:
| JP2000311518A | 2000-11-07 | |||
| JP2021172771A | 2021-11-01 |
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
Download PDF:
Previous Patent: HONEYCOMB STRUCTURE SHEET, LAMINATE, AND METHOD FOR PRODUCING SAME
Next Patent: TERAHERTZ DEVICE
Next Patent: TERAHERTZ DEVICE