Title:
TERAHERTZ DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/228965
Kind Code:
A1
Abstract:
A terahertz device according to the present invention comprises: a semiconductor substrate that has a substrate front surface and a substrate back surface which is located on the opposite side from the substrate front surface; an active element that is provided on the substrate front surface and that oscillates or detects electromagnetic waves; an insulation substrate that is disposed to the substrate back surface side of the semiconductor substrate and that supports the semiconductor substrate; and a metal layer that is disposed between the semiconductor substrate and the insulation substrate and that is in contact with the substrate back surface. The semiconductor substrate has a thickness less than the wavelength of the electromagnetic waves.
Inventors:
GAMO HIROMU (JP)
Application Number:
PCT/JP2023/019264
Publication Date:
November 30, 2023
Filing Date:
May 24, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H03B7/08; G01R29/12; H01L21/329; H01L29/06; H01L29/15; H01L29/88
Foreign References:
| JP2018507534A | 2018-03-15 | |||
| JP2016111542A | 2016-06-20 | |||
| JP2016213732A | 2016-12-15 | |||
| JP2013057719A | 2013-03-28 | |||
| JP2006278366A | 2006-10-12 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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