Title:
HONEYCOMB STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/166297
Kind Code:
A1
Abstract:
A honeycomb structure 100 that comprises: a plurality of columnar honeycomb segments 10 that have partitions 13 that form a plurality of cells 12 that constitute fluid channels that extend from a first end surface 11a to a second end surface 11b and plugged parts 14 at which open end parts of prescribed cells 12 are plugged on the first end surface 11a side and open end parts of the remaining cells 12 are plugged on the second end surface 11b side; and joining layers 20 that are provided to join side surfaces of the columnar honeycomb segments 10. The partitions 13 contain silicon and silicon carbide and have an average thickness of 0.152–0.254 mm. The honeycomb structure 100 satisfies expressions (1)–(3). (1) y≤1000, (2) y≤717.92x-0.095, and (3) y≥462.4x-0.153, y being the maximum temperature (°C) at which the honeycomb structure 100 may be used, and x being a thermal conductivity factor that is represented by the following equation. Thermal conductivity factor=(thermal conductivity of partitions 13×thermal conductivity of joining layers 20)/(average thickness of joining layers 20×porosity of partitions 13).
Inventors:
KONNO YOSHIKI (JP)
Application Number:
PCT/JP2020/034764
Publication Date:
August 26, 2021
Filing Date:
September 14, 2020
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
B01J35/04; B01D39/20; B01D46/00; C04B37/00; F01N3/022
Domestic Patent References:
| WO2007119407A1 | 2007-10-25 |
Foreign References:
| JP2003117322A | 2003-04-22 | |||
| JP2003155908A | 2003-05-30 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
Download PDF: