HOT STAMP MOLDED BODY, AND METHOD FOR PRODUCING SAME

Title:

HOT STAMP MOLDED BODY, AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2020/235599

Kind Code:

A1

Abstract:

This hot stamp molded body has a chemical composition containing: 0.0005-0.0080 mass% of C; 0.005-1.000 mass% of Si; 0.01-2.50 mass% of Mn; 0.010-0.100 mass% of Al; at most 0.200 mass% of P; at most 0.100 mass% of S; at most 0.0100 mass% of N; and the balance that is Fe and impurities. In addition, the hot stamp molded body has a metallic structure comprising, in an area fraction: 20-95% (exclusive of 95) of an acicular ferrite; 5-80% of a polygonal ferrite; and 0-5% of a remaining structure.

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Inventors:

KUSUMI KAZUHISA (JP)
TOMOKIYO TOSHIMASA (JP)
TODA YURI (JP)
NAITO YASUAKI (JP)
MAEDA DAISUKE (JP)
IRIKAWA HIDEAKI (JP)

Application Number:

PCT/JP2020/019973

Publication Date:

November 26, 2020

Filing Date:

May 20, 2020

Export Citation:

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Assignee:

NIPPON STEEL CORP (JP)

International Classes:

C21D9/00; C21D1/18; C22C38/00; C22C38/60

Domestic Patent References:

WO2012157581A1

2012-11-22

Foreign References:

JP2008214656A	2008-09-18
JP2006037162A	2006-02-09
JP2005248320A	2005-09-15
JP2006219741A	2006-08-24

Attorney, Agent or Firm:

TANAI Sumio et al. (JP)

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