Title:
HOT STAMP MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/039973
Kind Code:
A1
Abstract:
This hot stamp molded body is provided with a base material, a plating layer formed on the surface of the base material, and an oxide film formed on the surface of the plating layer, wherein: the plating layer has a chemical composition of containing 20.00-45.00 mass% of Al, 10.00-45.00 mass% of Fe, 4.50-15.00 mass% of Mg, 0.10-3.00 mass% of Si, 0.05-3.00 mass% of Ca, 0-0.50 mass% of Sb, 0-0.50 mass% of Pb, 0-1.00 mass% of Cu, 0-1.00 mass% of Sn, 0-1.00 mass% of Ti, 0-0.50 mass% of Sr, 0-1.00 mass% of Cr, 0-1.00 mass% of Ni, 0-1.00 mass% of Mn, and the balance comprising Zn and impurities; and the oxide film has a chemical composition containing 20.0-55.0 atomic% of Mg, 0.5-15.0 atomic% of Ca, 0 to 15.0 atomic% of Zn, 0-10.0 atomic% (exclusive of 10.0) of Al, and the balance comprising O and at most 5.0 atomic% of impurities in total, and the one side adhesion amount of the oxide film is 0.01-10 g/m2.
Inventors:
MITSUNOBU TAKUYA (JP)
TOKUDA KOHEI (JP)
TAKAHASHI TAKEHIRO (JP)
TAKEBAYASHI HIROSHI (JP)
TOKUDA KOHEI (JP)
TAKAHASHI TAKEHIRO (JP)
TAKEBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2020/032646
Publication Date:
March 04, 2021
Filing Date:
August 28, 2020
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C23C2/26; C21D1/18; C21D9/00; C22C18/04; C22C21/00; C22C30/06; C22C38/34; C23C2/06; C23C2/12; C23C2/28; C22C38/00; C22C38/04
Domestic Patent References:
| WO2018139620A1 | 2018-08-02 | |||
| WO2018221738A1 | 2018-12-06 |
Foreign References:
| JP2010180428A | 2010-08-19 | |||
| JP2019157206A | 2019-09-19 | |||
| JP2012112010A | 2012-06-14 | |||
| JP2014514436W | ||||
| JP2017066459A | 2017-04-06 |
Other References:
See also references of EP 4023787A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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