Title:
HOT-STAMPED FORMED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/186931
Kind Code:
A1
Abstract:
This hot-stamped formed product having excellent shock absorption ability is characterized by having a prescribed component composition, and also characterized in that: the microstructure contains prior austenite having an average grain size of 3 μm or less; the microstructure also contains lower bainite, martensite, and/or tempered martensite, which correspond to an area ratio of 90% or more; and the grain boundary solid/solution ratio Z, defined as Z = (mass% of Nb and/or Mo at the grain boundary)/(mass% of Nb and/or Mo at dissolution), is 0.3 or higher.
Inventors:
TODA YURI (JP)
HIKIDA KAZUO (JP)
FUJINAKA SHINGO (JP)
TANAKA TOMOHITO (JP)
HIKIDA KAZUO (JP)
FUJINAKA SHINGO (JP)
TANAKA TOMOHITO (JP)
Application Number:
PCT/JP2018/013372
Publication Date:
October 03, 2019
Filing Date:
March 29, 2018
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C22C38/00; C22C38/60; C21D1/18; C21D9/00; C21D9/46
Domestic Patent References:
WO2015147216A1 | 2015-10-01 | |||
WO2015194571A1 | 2015-12-23 | |||
WO2015147216A1 | 2015-10-01 |
Foreign References:
JP2017043825A | 2017-03-02 | |||
JP2010174282A | 2010-08-12 | |||
JP5369714B2 | 2013-12-18 | |||
JPS5114691B1 | 1976-05-11 | |||
JP2014015638A | 2014-01-30 | |||
JP2002309345A | 2002-10-23 |
Other References:
See also references of EP 3778952A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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