Title:
HOUSING STRUCTURE, ELECTRONIC DEVICE, AND PREPARATION METHOD FOR HOUSING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/233122
Kind Code:
A1
Abstract:
The present application relates to the technical field of electronic devices, and provided in the embodiments thereof are a housing structure, an electronic device, and a preparation method for a housing structure. The housing structure comprises: a housing and an antenna texture circuit. At least a portion of the housing is made of a non-metal material so as to form a non-metal part; and the non-metal part is provided with a first surface and a second surface that are opposite to each other, an outer part of the first surface that faces the electronic device, and an inner part of the second surface that faces the electronic device. The antenna texture circuit is provided on the first surface; or the second surface is provided with a groove, and the antenna texture circuit is provided in the groove.
Inventors:
CUI YONGTAO (CN)
YANG YUCHAN (CN)
MA RONG (CN)
SI HESHUAI (CN)
YANG YUCHAN (CN)
MA RONG (CN)
SI HESHUAI (CN)
Application Number:
PCT/CN2021/091784
Publication Date:
November 25, 2021
Filing Date:
April 30, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K5/02; H01Q1/24
Foreign References:
| CN104051844A | 2014-09-17 | |||
| CN108539386A | 2018-09-14 | |||
| CN102404958A | 2012-04-04 | |||
| CN105742797A | 2016-07-06 | |||
| CN105594059A | 2016-05-18 | |||
| KR20120120790A | 2012-11-02 | |||
| CN202010438304A | 2020-05-21 | |||
| CN202010693924A | 2020-07-17 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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