Title:
WAFER EDGE EXPOSURE APPARATUS AND METHOD, AND LITHOGRAPHIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/233121
Kind Code:
A1
Abstract:
A wafer edge exposure apparatus and method, and a lithographic device. The apparatus comprises a wafer bearing module (20), a mask (30), a mask driving module (40), an alignment module (50), an exposure module (60), and a control module (70); the wafer bearing module (20) is configured to bear a wafer (10) and drive the wafer (10) to rotate; the wafer (10) comprises an active region (110) and an edge region (120) surrounding the active region (110), and the edge region (120) comprises at least one recess unit (123); the shape of the mask (30) is the same as the shape of the active region (110); the mask driving module (40) is configured to drive the mask (30) to rotate; the alignment module (50) is configured to detect an alignment state of the mask (30) and the wafer (10); the control module (70) is configured to control motion states of the wafer bearing module (20) and the mask driving module (40), and is further configured to control, when the alignment module (50) detects that the mask (30) and the wafer (10) are aligned, the exposure module (60) to perform wafer (10) edge exposure on the wafer (10).
Inventors:
LIANG XUEYU (CN)
Application Number:
PCT/CN2021/091633
Publication Date:
November 25, 2021
Filing Date:
April 30, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G03F1/00
Foreign References:
| CN105372941A | 2016-03-02 | |||
| US7277156B2 | 2007-10-02 | |||
| CN108319057A | 2018-07-24 | |||
| CN101526757A | 2009-09-09 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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