Title:
HYDROPHILIC TREATMENT LIQUID FOR SEMICONDUCTOR WAFER SURFACE
Document Type and Number:
WIPO Patent Application WO/2020/196199
Kind Code:
A1
Abstract:
Provided is a hydrophilic treatment liquid for semiconductor wafer surfaces which is capable of imparting hydrophilicity to a semiconductor wafer surface. The hydrophilic treatment liquid for semiconductor wafer surfaces comprises water and a compound represented by formula (1), and the total content of the water and the compound represented by formula (1) is 95 weight% or more. R1O-(C3H6O2)n-H (1)
(In the formula, R1 is a hydrogen atom, a hydrocarbon group having 1 to 24 carbon atoms which may have a hydroxyl group, or a group represented by R2CO, R2 is a hydrocarbon group having 1 to 24 carbon atoms, and n is an average degree of polymerization of glycerol units indicated in parentheses and is 2 to 60.)
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Inventors:
SAKANISHI YUICHI (JP)
Application Number:
PCT/JP2020/012142
Publication Date:
October 01, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
H01L21/304
Foreign References:
| JP2018006538A | 2018-01-11 | |||
| JP2018078287A | 2018-05-17 | |||
| JP2018128638A | 2018-08-16 |
Attorney, Agent or Firm:
GOTO & CO. (JP)
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