Title:
IC CARD AND METHOD FOR MANUFACTURING IC CARD
Document Type and Number:
WIPO Patent Application WO/2005/057484
Kind Code:
A1
Abstract:
Disclosed is an IC card (1) wherein an IC module (9), which has an antenna (7) and an IC chip (6) and is supported by a module supporting body (8), is interposed between opposing first sheet material (2) and second sheet material (3) and integrated together using adhesives (4, 5). The IC card (1) is characterized by having an antistatic layer (11) on at least one side of the module supporting body (8). With such a constitution, damages to electronic components caused by electrostatic charges as well as mixing of foreign particles into the IC card can be prevented during production. Consequently, there can be obtained an IC card having good surface roughness.
More Like This:
| JPH09259242 | CARD |
| JPS6451995 | MODULE SUBSTRATE FOR SEMICONDUCTOR CARD |
Inventors:
ITO MINEKO (JP)
Application Number:
PCT/JP2004/018335
Publication Date:
June 23, 2005
Filing Date:
December 02, 2004
Export Citation:
Assignee:
KONICA MINOLTA PHOTO IMAGING (JP)
ITO MINEKO (JP)
ITO MINEKO (JP)
International Classes:
B42D15/10; G06K19/07; G06K19/077; H05F1/00; H05F3/02; (IPC1-7): G06K19/077; B42D15/10; H05F1/00; H05F3/02
Foreign References:
| JP2000298717A | 2000-10-24 |
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