Title:
IC CHIP, HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/176962
Kind Code:
A1
Abstract:
The present invention improves isolation between mutually-different switch units. In an IC chip (100), a control unit (3) is connected to a first switch unit (1) and/or a second switch unit (2). In plan view from the thickness direction of a substrate (10), a plurality of first terminals (4) are located between the first switch unit (1) and the second switch unit (2) in a first direction (D1), and are lined up in a row in a second direction (D2) intersecting the first direction (D1). In plan view from the thickness direction of the substrate (10), a plurality of second terminals (5) are located between the plurality of first terminals (4) and either the first switch unit (1) or the second switch unit (2), and are lined up in a row in the second direction (D2). The plurality of first terminals (4) include at least one control terminal (43) from among a plurality of control terminals (43) connected to the control unit (3). The plurality of second terminals (5) include a ground terminal (51).
Inventors:
ONO ATSUSHI
Application Number:
PCT/JP2023/010597
Publication Date:
September 21, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L27/04; H01L21/822; H01L25/04; H01L25/18; H04B1/38
Domestic Patent References:
| WO2018110393A1 | 2018-06-21 | |||
| WO2019054154A1 | 2019-03-21 |
Foreign References:
| JP2021158569A | 2021-10-07 | |||
| JP2021052377A | 2021-04-01 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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