Title:
IC INSPECTION SOCKET
Document Type and Number:
WIPO Patent Application WO/2022/202246
Kind Code:
A1
Abstract:
An IC inspection socket comprising: a pin block having a plurality of contact probes; a floating plate for guiding an IC package to be inspected; and a heat-generating body for heating the IC package. The heat-generating body is in contact with the IC package.
Inventors:
TAKEI DAIGO (JP)
TAKEUCHI KAZUMA (JP)
TAKEUCHI KAZUMA (JP)
Application Number:
PCT/JP2022/009669
Publication Date:
September 29, 2022
Filing Date:
March 07, 2022
Export Citation:
Assignee:
YOKOWO SEISAKUSHO KK (JP)
International Classes:
H01R33/76
Foreign References:
| JP2004327264A | 2004-11-18 | |||
| JP2020134232A | 2020-08-31 | |||
| US10466273B1 | 2019-11-05 | |||
| JP2020017455A | 2020-01-30 |
Attorney, Agent or Firm:
KURODA Yasushi et al. (JP)
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