Title:
THERMAL CONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2022/202247
Kind Code:
A1
Abstract:
This thermal conductor (10) comprises a thermal conduction part (20) including a metal, and a protrusion (30) that is attached to a surface of the thermal conduction part (20) and that extends from the thermal conduction part (20), the protrusion (30) having a core material (32) composed of a metal bulk body, and a metal fiber structure (34) fused around the core material (32).
Inventors:
MORIUCHI HIDEKI (JP)
Application Number:
PCT/JP2022/009673
Publication Date:
September 29, 2022
Filing Date:
March 07, 2022
Export Citation:
Assignee:
TOMOEGAWA CO LTD (JP)
International Classes:
H01L23/373; H05K7/20
Domestic Patent References:
| WO2016002870A1 | 2016-01-07 | |||
| WO2021070470A1 | 2021-04-15 | |||
| WO2017061307A1 | 2017-04-13 |
Foreign References:
| JP2017135227A | 2017-08-03 | |||
| JPS5736495U | 1982-02-26 | |||
| JP2000101004A | 2000-04-07 |
Attorney, Agent or Firm:
KASHIMA Hiromoto (JP)
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