Title:
IC TAG LABEL
Document Type and Number:
WIPO Patent Application WO/2008/047630
Kind Code:
A1
Abstract:
An IC tag label (1A) is provided with an inlet base material (11); an IC chip protection sheet
(4) arranged on one surface of the inlet base material (11); and an antenna pattern
(2) and an IC chip (3) arranged on the other surface of the inlet base material (11).
On the other surface of the inlet base material (11), an adhesive (6) is arranged
to cover the antenna pattern (2) and the IC chip (3). At a portion that corresponds
to the IC chip (3) on the IC chip protection sheet (4), an opening (12) to be a back
clearance of the IC chip (3) is formed.
More Like This:
| JPS63276836 | MULTIFUNCTIONAL CARD |
| JP2006079252 | INTERPOSER-MOUNTING METHOD AND INTERPOSER-MOUNTED SHEET |
| JPH10114180 | SEMICONDUCTOR CARD AND PRODUCTION THEREOF |
Inventors:
OGATA TETSUJI (JP)
Application Number:
PCT/JP2007/069676
Publication Date:
April 24, 2008
Filing Date:
October 09, 2007
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
OGATA TETSUJI (JP)
OGATA TETSUJI (JP)
International Classes:
G06K19/077; G06K19/07
Foreign References:
| JPH09135189A | 1997-05-20 | |||
| JP2004318605A | 2004-11-11 | |||
| JP2006010731A | 2006-01-12 | |||
| JP2005071063A | 2005-03-17 | |||
| JP2006236081A | 2006-09-07 |
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Room 323 Fuji Bldg.,2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
Download PDF: