Title:
IMAGE CAPTURE UNIT AND ENDOSCOPE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/079328
Kind Code:
A1
Abstract:
Provided is an image capture unit, comprising: a semiconductor package which comprises an image capture element and wherein a connector electrode is formed on the back surface of said semiconductor package; a circuit substrate wherein connector electrodes are respectively formed on the front surface and the back surface thereof, said circuit substrate being stacked on the back surface side of the image capture element; a variant circuit substrate wherein connector electrodes are respectively formed on the front surface and the back surface thereof, said variant circuit substrate being stacked on the back surface side of the circuit substrate; a digital component which is mounted on the back surface of the circuit substrate; first solder balls which connect the connection electrode on the back surface of the semiconductor package with the connection electrode on the front surface of the circuit substrate; and second solder balls which connect the connection electrode on the back surface of the circuit substrate with the connection electrode on the front surface of the variant circuit substrate, said second solder balls being fewer in number than the first solder balls and having different diameters from the first solder balls. The circuit substrate and the variant circuit substrate are contained within a projection plane of the semiconductor package in an optical axis direction. An image capture unit is thus provided whereby it is possible to make reliable connections among the semiconductor package, the circuit substrate, and the variant circuit substrate, using the solder balls.
Inventors:
KOBAYASHI HIROYUKI (JP)
MOTOHARA HIROYUKI (JP)
MOTOHARA HIROYUKI (JP)
Application Number:
PCT/JP2017/037456
Publication Date:
May 03, 2018
Filing Date:
October 17, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; A61B1/05; G02B23/24; H01L27/146
Foreign References:
| JP2004207461A | 2004-07-22 | |||
| JP2003046255A | 2003-02-14 | |||
| JP2007258430A | 2007-10-04 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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