IMAGE DISPLAY APPARATUS AND MOUNTING INSPECTION METHOD FOR SAME

WIPO Patent Application WO/2014/046099

A1

Provided are: an image display apparatus wherein the COG mounting state of an IC chip that is mounted on a substrate by COG mounting can be easily checked; and a mounting inspection method for the image display apparatus. An image display apparatus (1) is provided with: an image display panel having a TFT array substrate; an IC chip (5) mounted on the image display panel by COG mounting; and an FPC (6) electrically connected to the IC chip. The image display apparatus is configured by having the TFT array substrate (3) provided with first connecting wiring (21) that electrically connects an IC connecting pad and an FPC connecting pad to each other, and by having the FPC provided with test pads (41, 42), second connecting wiring (22) that electrically connects the test pads and an FPC-side connecting pad (60) to each other, and short-circuiting wiring (23) that short-circuits dummy pads to each other via the FPC-side connecting pad. In this mounting inspection method, the mounting state of the IC chip is inspected by measuring electrical resistance between the test pads.

JP2022111590	DISPLAY DEVICE
WO/2023/276932	POLARIZING FILM AND IMAGE DISPLAY DEVICE
WO/2014/192541	DISPLAY PANEL WITH PRESSING SENSOR, AND ELECTRONIC DEVICE WITH PRESSING INPUT FUNCTION

KAZIKAWA YOSUKE

PCT/JP2013/075069

March 27, 2014

September 18, 2013

Click for automatic bibliography generation  

SHARP KK (JP)

G09F9/00; G02F1/13; G02F1/1345; G09F9/30

WO2010016312A1

2010-02-11

JP2009282285A	2009-12-03
JP2008241748A	2008-10-09
JP2003090856A	2003-03-28
JP2009223265A	2009-10-01
JP2010145712A	2010-07-01
JPH06250199A	1994-09-09

SANO SHIZUO (JP)
Shizuo Sano (JP)

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