Title:
IMAGING DEVICE AND CAMERA SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/199560
Kind Code:
A1
Abstract:
This imaging device is provided with: a semiconductor substrate; a wiring layer that is located over the semiconductor substrate and includes a plurality of wirings; a plurality of pixel electrodes that are each located over the wiring layer and correspond one-to-one to a plurality of pixels, respectively; a shield electrode located over the wiring layer and arranged between the plurality of pixel electrodes; a counter electrode located above the plurality of pixel electrodes and the shield electrode; and a photoelectric conversion layer located between the counter electrode, and plurality of pixel electrodes and the shield electrode. The wiring layer comprises: a shield wiring 107; and a plurality of FD wirings 110 that are respectively connected to the plurality of pixel electrodes and correspond one-to-one to the pixel electrodes. The shield wiring 107 is connected to the shield electrode. The shield wiring 107 includes a plurality of openings 71 that each overlap, in plan view, with at least one FD wiring 110 among the plurality of FD wirings 110.
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Inventors:
KANEHARA HIDENARI
SATO YOSHIHIRO
SATO YOSHIHIRO
Application Number:
PCT/JP2023/000307
Publication Date:
October 19, 2023
Filing Date:
January 10, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L27/146; H04N25/617; H04N25/70
Domestic Patent References:
| WO2020026851A1 | 2020-02-06 | |||
| WO2020090150A1 | 2020-05-07 | |||
| WO2014208047A1 | 2014-12-31 | |||
| WO2017169478A1 | 2017-10-05 | |||
| WO2013001809A1 | 2013-01-03 |
Foreign References:
| JP2020077848A | 2020-05-21 | |||
| JP2017108380A | 2017-06-15 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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